Franco Policardi (Author), Marion Thebault (Author)

Abstract

The buffer action of certain wood species can intensely affect the curing and hardening of some thermosetting wood adhesives. The present article presents a quantification of such buffering effects, determined under controlled conditions, in various wood species. The buffer capacity of oak has been found to be rather extreme and is likely to affect quite heavily the ability of urea-formaldehyde (UF) and melamine-urea-formaldehyde (MUF) wood panel adhesives in industrial operations. A variation of the buffer capacity of furnishes containing between 0% and 30% oak chips has been investigated. This was correlated with the internal bond (IB) strength of MUF bonded laboratory particleboards. The wood mixture buffering capacity increases with the oak content, while the panel IB strength decreases.

Keywords

zmogljivost blažilnika lesa;hrastov les;kompoziti iz lesenih plošč;melamine-urea-formaldehid;lepila za les;wood buffer capacity;oak wood;wood panel composites;melamine-urea-formaldehyde;wood adhesives;

Data

Language: English
Year of publishing:
Typology: 1.01 - Original Scientific Article
Organization: UL FE - Faculty of Electrical Engineering
UDC: 62:630*8
COBISS: 23399683 Link will open in a new window
ISSN: 2073-4360
Views: 145
Downloads: 51
Average score: 0 (0 votes)
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Other data

Secondary language: Slovenian
Secondary keywords: zmogljivost blažilnika lesa;hrastov les;kompoziti iz lesenih plošč;melamine-urea-formaldehid;urea-formaldehid;lepila za les;
Type (COBISS): Article
Pages: str. 1-9
Volume: ǂno. ǂ7
Issue: 1540
Chronology: 2020
DOI: 10.3390/polym12071540
ID: 14101885