Inkapsulacija elektronskih komponent v polimerno maso

magistrsko delo magistrskega študijskega programa II. stopnje Strojništvo

Nace Pavlin (Author), Andrej Žerovnik (Mentor)

Abstract

Magistrska naloga obravnava problem vgrajevanja elektronskih komponent v ohišje. Zajema pregled literature, kateri sledi zasnova konceptov. Z analitično hierarhičnim procesom se ovrednoti koncepte in izdelovalne tehnologije. Z numeričnimi simulacijami se preveri konstrukcijske rešitve in optimizira tehnologijo najbolje ocenjenega koncepta. Ključne mehanske parametre materiala ohišja se določi eksperimentalno. Ugotovili smo, da je za dano aplikacijo najbolj primerna tehnologija inkapsulacije - poting. Prav tako z izbiro konstrukcije močno vplivamo na napetosti, ki se pojavljajo na vezju. Ugotovili smo, da s spreminjanjem temperature strjevanja vplivamo na mehanske lastnosti materiala in posledično na napetosti v polimerno-elektronskem sestavu.

Keywords

magistrske naloge;inkapsulacija;metoda AHP;poting;prebrizgavanje;numerična simulacija;polimerni materiali;

Data

Language:	Slovenian
Year of publishing:	2023
Typology:	2.09 - Master's Thesis
Organization:	UL FS - Faculty of Mechanical Engineering
Publisher:	[N. Pavlin]
UDC:	004.942:519.876.5:621.38(043.2)
COBISS:	166142211
Views:	35
Downloads:	11
Average score:	0 (0 votes)
Metadata:

Other data

Secondary language:	English
Secondary title:	Encapsulation of electronic components in polymer resin
Secondary abstract:	The master thesis covers the issue of integrating electronic components into the housing, including a literature overview followed by concept design. With anlytic hierarchy process, we evaluate concepts and manufacturing technologies. Additionally, with numerical simulation, we can asses design solutions and optimizes the technology of the highest classified concept. Key material mechanical parameters of the housing are experimentally tested. It was discovered that for the provided application, the most appropriate technology is incapsulation potting. Moreover, with the construction selection, we can massively affect the tension on the PCB. To conclude, we discovered that with changing temperature curing, we could impact the mechanical properties of the material and consequently impact the tension into a polymer-electronic assembly.
Secondary keywords:	master thesis;encapsulation;AHP analysis;potting;overmolding;numerical simulation;polymer materials;
Type (COBISS):	Master's thesis/paper
Study programme:	0
Embargo end date (OpenAIRE):	1970-01-01
Thesis comment:	Univ. Ljubljana, Fak. za strojništvo
Pages:	XXII, 83 str.
ID:	19892399