Aleš Ugovšek (Avtor), Milan Šernek (Avtor)

Povzetek

Liquefied wood is a potential alternative to the synthetic adhesives which are used for the bonding of wood. Despite the ability of liquefied wood to self-crosslink, bonds formed during the bonding of wood with liquefied wood do not achieve sufficient shear strength and have poor resistance to water. For this reason the process of the curing of liquefied wood, the influence of various parameters on the shear strength of bonds, and the structure of bonds formed during the bonding were analyzed. It was found that the chemical curing of liquefied wood started after water and solvent had been removed from it. When bonding wood, the curing liquefied wood takes place faster because, in addition to evaporation, the transition of both vaporous components from the liquefied wood to the lamellas also occurs. During the bonding of 5 mm thick beech lamellas with liquefied wood having a negative pH, at optimal bonding conditions (180 °C, 12 min), a specific type of bond was formed. It consisted of a central part of carbonized wood cells of the bonded lamellas and the cured liquefied wood, and a narrow layer of partly delignified wood cells at the border between the central part and bonded lamella.

Ključne besede

utekočinjeni les;lepljenje lesa;

Podatki

Jezik: Slovenski jezik
Leto izida:
Tipologija: 1.08 - Objavljeni znanstveni prispevek na konferenci
Organizacija: UL BF - Biotehniška fakulteta
UDK: 630*8
COBISS: 2396041 Povezava se bo odprla v novem oknu
Matična publikacija: Monitoring v gozdarstvu, lesarstvu in papirništvu
Št. ogledov: 929
Št. prenosov: 340
Ocena: 0 (0 glasov)
Metapodatki: JSON JSON-RDF JSON-LD TURTLE N-TRIPLES XML RDFA MICRODATA DC-XML DC-RDF RDF

Ostali podatki

Sekundarni jezik: Neznan jezik
Sekundarni naslov: Monitoring of curing of liquefied wood and bonding of woodwith liquefied wood
Sekundarne ključne besede: adhesive bond;adhesive;bonded wood;liquefied wood;curing;
Vrsta datoteke: application/pdf
Vrsta dela (COBISS): Znanstveno delo
Strani: Str. 68-74
ID: 9077420