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Oznake: power delivery network (PDN);3D heterogeneous integration;Logic on Memory (LoM);IR drop;impedance characterization;TSV;hybrid bonding;SPICE;Spectre;Python;simulation framework;
3D heterogeneous integration is becoming one of the key emerging technologies for next generation high performance computing systems. It has emerged as a response to the continuous need to reduce system dimensions while increasing integration density and system performance. Technologies such as th ...
Leto: 2026 Vir: Fakulteta za elektrotehniko (UL FE)
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