Pingye Xu (Author), Fei Tong (Author), Virginia A. Davis (Author), Minseo Park (Author), Michael Hamilton (Author)

Abstract

Solution-Based Fabrication of Carbon Nanotube Bumps for Flip-Chip Interconnects

Keywords

fabrication;electrical resistance measurements;substrates;dispersion;resistance;surface treatment;

Data

Language: English
Year of publishing:
Typology: 1.01 - Original Scientific Article
Organization: UNG - University of Nova Gorica
UDC: 53
COBISS: 4636923 Link will open in a new window
ISSN: 1536-125X
Views: 3500
Downloads: 0
Average score: 0 (0 votes)
Metadata: JSON JSON-RDF JSON-LD TURTLE N-TRIPLES XML RDFA MICRODATA DC-XML DC-RDF RDF

Other data

URN: URN:SI:UNG
Type (COBISS): Not categorized
Pages: str. 1118-1126
Volume: ǂVol. ǂ13
Issue: ǂno. ǂ6
Chronology: Nov. 2014
DOI: 10.1109/TNANO.2014.2340132
ID: 9249792